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    Photonic Integrated Circuits Conference: High speed photonic integrated receivers for 100G and above
    
        
    
        
    source：laserfair.com
    
        
      release：Johnny Lee
    
        
    keywords： PIC  photonics 
    
        
    Time：2015-09-02 
    
        
    
      
    
      
      High speed photonic integrated receivers for 100G and above - William Ring
    

    

    Abstract:
    

    Integration of Photonics on chip is necessary to address the future demands of the datacenter.
    

    
The market demands for low cost, small footprint and low power require innovation in the design of the photonic components. To reduce power and to enable on-chip integration requires designs that enable minimal temperature variation of MUX/De-MUX for the wavelength control and management. 
    

    
BB Photonics is developing a platform approach integrating low loss dielectrics into InP wafers for wavelength routing and functionality to enable mode matched devices that have a low thermal variation. 
    

    
This unique approach reduces size, cost, adds functionality and enables high coupling to the passive waveguides from the III-V components that can then be integrated with Spot-size converters and high-speed waveguide devices. 
    

    
The current work on 100GbE LR4 device integration will be discussed.
    

    

    
    
        
    
            2 days, 6 themes, 30+ presentations
        
    
        

    

    Sales of PICs are soaring, with their deployment helping to boost the capacity of networks and data centres. To aid this industry, we are strengthening the relationships between the makers and the users of these integrated circuits by launching PIC International, a global conference dedicated to this industry. 
    

    
Attendees at the inaugural PIC International conference will hear industry-leading insiders delivering more than 30 presentations spanning six sectors. 
    

    
PIC International provides comprehensive coverage of all aspects of this industry, from basic research to materials, equipment, packaging, and the incorporation of chips in data centres and optical networks. So whether you focus on system integration, developing and manufacturing components, financing this sector, or providing the materials and equipment needed to support this industry, PIC International is your must-attend conference for 2016.? 
    

    
PIC International will be co-located with the sixth CS International conference (Compound Semiconductor).
    

    Presentations commited to date include:
    

    
    
        
    
            Aarhus University
    
                ArtIC Photonics
    
            Aurrion 
    
            BB Photonics 
    
            CEA-Leti 
    
            CISCO 
    
            Coriant 
    
            Finisar
    
            Evans Analytical Group
    
            EV Group 
    
            
     
    
                		
            Global Communication Semiconductors
    
            HP
    
            Huawei 
    
            IBM 
    
            Istituto Superiore Mario Boella 
    
            JePPIX 
    
            LioniX BV
    
            Luceda Photonics 
    
            
    
                		
            McGill University
    
            Mellanox Technologies
    
            Microsoft 
    
            NTT Photonics Labs
    
            PhoeniX Software 
    
            Politecnico di Milano 
    
            Ranovus 
    
            Smart Photonics 
    
            TeraXion 
    
            TU Eindhoven