4月24日，上海世博展覽館 9號會議室
工業界正在嘗試探索采用低溫焊料組裝手機、平板電腦和移動電腦等消費電子產品。將錫銀銅（SAC）焊膏的峰值回流溫度從當前240℃以上的水平降低，由此帶來經濟性、環境和技術上的優勢。低溫焊接還為新興市場如超移動計算、可穿戴設備和物聯網（IOT）提供了一種潛在的解決方案，以減少更小、更薄和高度集成的電子設備的組裝中的動態翹曲。將回流峰值溫度降低到200℃以下可以降低能耗，提高表面貼裝良率，但同時也需要新的焊接材料具備良好的可靠性和工藝性。
iNEMI技術工作坊鼓勵與會者在研討中互動，討論和分享有關低溫焊料的信息和經驗，例如：
· 低溫焊料材料和技術的新發展和未來計劃
· iNEMI基于錫鉍的低溫焊接工藝和可靠性項目報告
· 提高產量和質量所需的研究創新
· 未來產品和技術的要求對焊錫材料和工藝的影響
· 低溫焊錫材料的工藝性、可靠性和失效分析
· 討論新的合作項目機會，推動低溫焊錫技術在行業中的開發和部署
本次專項研討會的目標人群是致力于開發和鑒定新型低溫焊料解決方案的電子制造商、研究人員和供應商，您將有機會和他們會面并分享和討論。
議程計劃
|
時間 |
議題 |
演講嘉賓 |
|
9:30 – 9:45 |
簽到 |
|
|
9:45 – 10:00 |
歡迎及研討會簡介 |
傅浩博士，iNEMI國際電子生產商聯盟 |
|
10:00 – 10:30 |
使用低溫焊接的表面貼裝技術 |
Kok Kwan Tang，CPTD 技術項目經理， Intel英特爾 |
|
10:30 – 10:55 |
電子封裝中的低溫焊接合金系統 |
沈駿教授，博導， 重慶大學 |
|
10:55 – 11:20 |
iNEMI基于錫鉍的低溫焊接工藝和可靠性項目報告, 傅浩博士, 亞太區及項目管理總監, iNEMI國際電子生產商聯盟 |
|
|
11:20 – 11:45 |
題目待定 |
戴爾 |
|
11:45 – 13:00 |
午餐 |
|
|
13:00 – 13:25 |
新一代SMT低溫焊接材料的開發 |
Naoki Kubota，技術銷售專員，田村電子 |
|
13:25 – 13:50 |
用于SMT的低溫焊接” |
Domini Zhang，運營工程經理，偉創力 |
|
13:50 – 14:15 |
先進的表面貼裝無鉛低溫焊接材料 |
Watson Tseng，研發副總裁，美國總經理，昇貿科技 |
|
14:15 – 14:30 |
茶歇 |
|
|
14:30 – 14:55 |
用于下一代裝配的高可靠低溫焊接合金 |
Annie Yang，中國區市場經理，麥德美愛法 |
|
14:55 – 15:20 |
電子裝配中的低溫焊接技術 — 對裝配和可靠性的挑戰 |
尚攀舉博士，資深工程師，華為 |
|
15:20 – 15:45 |
優諾LTS解決方案和應用實踐 — NWO的解決與LTS混合焊點評價新方法 |
陳欽，研發經理，蘇州優諾 |
|
15:45 – 16:00 |
茶歇 |
|
|
16:00 – 16:20 |
座談專家簡報 |
|
|
16:20 – 17:00 |
座談問答 |
|
|
17:00 – 17:15 |
總結 |
|
報名注冊
早鳥票（3月31日前）：760元人民幣，
常規票（3月31至4月18日前）： 900元人民幣
*登記費包括會議報告的材料、午餐券、咖啡/茶和水。
人民幣（支付）：
賬戶名： 澳龍信息科技（上海）有限公司
賬號： 310066865018010020955
收款行： 交通銀行上海市分行張江支行
開票事宜請聯系：sammulw@infosalons.com.cn
iNEMI Low-Temperature Solder Workshop – SMTA China East Conference
Join iNEMI at NEPCON China in Shanghai to discuss new developments and future plans for low-temperature solder materials and techniques.
iNEMI Low-Temperature Soldering Workshop
Held at 2019 SMTA China East Conference
Shanghai World Expo Exhibition and Convention Center
Wednesday, April 24 / 9:00-16:45 / Meeting room #9
Industry is exploring the adoption of low-temperature solder for the assembly of consumer electronic products, such as cell phones, tablets and mobile computers. Lowering peak reflow temperature from the current 240oC+ level for SnAgCu (SAC) solder paste has economic, environmental and technical benefits. Low-temperature soldering also provides a potential solution for reducing dynamic warpage in the assembly of smaller, thinner and highly integrated electronic packages for emerging markets such as ultra-mobile computing, wearable devices and Internet of Things (IoT). Lowering the reflow temperature below 200oC can reduce energy consumption and improve surface mount yields, but it also requires a new class of reliable soldering materials and processes.
This iNEMI workshop will provide an interactive forum where participants can discuss and share information about low-temperature solder such as:
· New developments and future plans for low-temperature solder materials and techniques
· Results from iNEMI’s BiSn-based Low-Temperature Soldering Process and Reliability project
· Innovations required to improve yield and quality
· Impact of future product and technology requirements on solder materials and processes
· Processability, reliability and failure mechanisms of low-temperature solder materials
· Collaborative project opportunities to streamline low-temperature solder technology development and deployment in the industry
This workshop gives you the opportunity to meet and network with leading electronics manufacturers, researchers and suppliers who are working to develop and qualify new low-temperature solder solutions.
Registration
Early bird registration is USD$100 (CNY 760) until March 31, after which the fee is $120 (CNY 900). The registration fee covers workshop presentations, lunch coupon, coffee/tea breaks and water.
Click here for
additional details, including agenda and registration.
https://community.inemi.org/ev_calendar_day.asp?date=4/24/2019&eventid=257
Preliminary Agenda
|
Time |
|
Topic |
Speaker |
|
9:30 – 9:45 |
|
Sign for workshop attendance |
|
|
9:45 – 10:00 |
Welcome and Workshop Overview |
Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI |
|
|
10:00 –10:30 |
Surface Mount Technology Using Low Temperature Soldering |
Kok Kwan Tang, CPTD Technical Program Manager, Intel |
|
|
10:30 –10:55 |
Low Temperature Solder Alloy System in Electronic Packaging |
Dr. Jun Shen, Professor, PhD Advisor, Chongqing University |
|
|
10:55 –11:20 |
iNEMI BiSn-based Low-Temperature Soldering Process and Reliability Project Report |
Dr. Haley Fu, Director for Asia Pacific & Project Management, iNEMI |
|
|
11:20 –11:45 |
Presentation title & speaker TBC |
Dell |
|
|
11:45 –13:00 |
Lunch |
|
|
|
13:00 –13:25 |
Development of Low Temperature Solder for Next Generation SMT |
Naoki Kubota, Technical Sales Specialist, Tamura |
|
|
13:25 –13:50 |
Low Temperature Solder for SMT |
Domini Zhang, Operations Engineering Manager, Flex |
|
|
13:50 –14:15 |
|
Advanced Low Temp Lead-free Solder for SMT Assembly |
Watson Tseng, Vice President of R&D and General Manager of America, Shenmao Technology |
|
14:15 –14:30 |
Tea break |
|
|
|
14:30 –14:55 |
High Reliability Low Temperature Soldering Alloys for Next Generation Assemblies |
Annie Yang, Regional Marketing Manager – China, MacDermid Alpha |
|
|
14:55 –15:20 |
Application of Low Temperature Soldering Technology in Electronic Assembly—Assembly and Reliability Challenges |
Dr. Panju Shang, Senior Engineer, Huawei |
|
|
15:20 –15:45 |
Solution and Application Practice of Eunow’s LTS paste — NWO Solution and new method of LTS Mixed Solder Joint evaluation |
Qin Chen, R&D Manager, Eunow |
|
|
15:45 –16:00 |
|
Tea break |
|
|
16:00 –16:20 |
Presentation from panel list |
|
|
|
16:20 –17:00 |
Panel discussion |
|
|
|
17:00 –17:15 |
Wrap up |
|
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